| 摘要 |
PURPOSE:To obtain a joined part of high quality in a relatively low vacuum by coating an element having oxidizing power as smaller as possible than that of active metallic elements contained in a materials to be joined on the joined surface simultaneously with cleaning of said surface by sputtering, then subjecting said surface to diffusion bonding. CONSTITUTION:Materials to be joined consisting of, for example, an Ni base alloy contg. 3.28wt% Al, 3.31wt% Ti are subjected to diffusion bonding by the following method: After these materials 6 to be joined are fed into a sample exchanging chamber 2 of a joining device, the inside of the chamber is evacuated to 10<-5> Torr vacuum and the materials are carried into a surface cleaning and treating chamber 1 under 10<-5> Torr. The joined surfaces of the materials 6 are etched by making Ar<+> ion beams incident thereto and immediately Ni is coated on said surfaces by a high frequency ion plating device 5 installed in the chamber 1. Thereafter, the joined surfaces of the materials 6 are held in tight contact with each other and the members are carried into a diffusion furnace 3 where said surfaces are subjected to diffusion bonding under conditions of, for example, 1,200 deg.C, 1kg/mm.<2> load and 10<-5> degree of vacuum. As a result, the diffusion bonded high quality joint of the Ni base alloy contg. much Al and Ti is obtained. |
