Method of manufacturing a housing having at least two integrated circuits.

摘要

Some of the side walls of the integrated circuits (A and B) are made oblique so that they form an angle of approximately 45 DEG with the plane of the integrated circuits. These walls are covered with an insulating layer (3). It is thus possible to form all the connections (C) of the housing simultaneously by the deposition of metal by making, in particular, connections on those side walls of the integrated circuits which have been made oblique and are covered with an insulating layer (3).