| 摘要 |
PURPOSE:To simplify the mounting and dismounting of a semiconductor device by a method wherein a post, which was fixed to a penetrated hole located on a wiring board, is inserted in one side of a bidirectional socket, and the external lead of the semiconductor device is inserted from other side of the bidirectional socket. CONSTITUTION:A post 9 is inserted to the penetrated hole 4a of a printed wiring board 4, the post 9 and a land 5 are soldered 7, one end of the post 9 si inserted in one side of a bidirectional socket 8, the external lead 3 of the semiconductor device is inserted in other side of the socket 8, and the post 9 and the external lead are connected using a contact 10. According to this constitution, the external lead of the semiconductor device can be securely and easily mounted on and dismounted from the printed substrate, and especially the constitution is effective when a number of external leads are used. |
