| 摘要 |
<p>Installation for the sawing of wafers of semiconductor material encompassing an alignment station (1), a sawing station (9), and a cleaning station (7). A handling device, provided to convey the wafers from one station to another, while ensuring a perfect positioning under the disc (11) of the saw, encompasses at least two supporting platforms (2, 13), of a mobile table (14) and a transfer angle-iron (15). Platforms (2) and (13) are provided to retain a wafer by suction, whether the platforms are carried by fixed support (6) or by mobile table (14).</p> |
