| 摘要 |
PURPOSE:To form copper plating with uniformity in electrodeposition and high adhesive strength equal to those of copper plating obtd. by plating in a cyanide bath by plating the surface of a steel wire with copper in a plating bath having a specified composition contg. copper sulfate. CONSTITUTION:In the manufacture of a copper plated steel wire for welding, a steel wire is electroplated as a cathode at >=150 A/dm<2> current density while passing the wire through a plating bath having 10-300g/lCuSO4.5H2O concn. and 10-100g/l H2SO4 concn. at 55-80 deg.C bath temp. by 250m/min rate. Copper plating with uniformity in elctrodeposition and superior adhesive strength to the base equal to those of copper plating obtd. by plating in a cyanide bath can be formed without causing environmental pollution. |
