| 摘要 |
1,173,506. Semi-conductor devices. MOTOROLA Inc. 21 Feb., 1967 [16 March, 1966], No. 8225/67. Heading H1K. A metal strip, e.g. of gold-plated nickel, for use in the manufacture of a plurality of multilead semi-conductor devices consists of two spaced parallel bands, e.g. 14 in Fig. 1, extending the full length of the strip, a plurality of spaced parallel lead connecting portions 16 integral with the bands and perpendicular thereto defining the lateral extremities of a single device, lead spacers 17 between the lead connecting portions, and a number of leads 19 extending outwardly therefrom, each associated with an electrode section 21 extending inwardly. The inward ends of electrodes 21 apart from one, 23, used as a mounting for the semi-conductor body, are arranged in parallel lines on opposite sides of the mounting. This arrangement facilitates thermocompression bonding of wires to the electrodes by machine and subsequent trimming of the bonded wires. In the embodiment indexing holes 29 are provided in the strip to enable it to be accurately located during mounting of an integrated circuit silicon body, attachment of lead wires, and encapsulation in epoxy or silicone resin, which is effected in a transfer mould. After encapsulation the device assembly is severed from the strip, the individual electrodes separated by a shearing operation and those not required are cut off. In a modified arrangement electrode assemblies of two bodies to be disposed in a common encapsulation are provided side by side in each section of the strip. In another arrangement (Fig. 9, not shown) each strip section includes the electrode assemblies of three bodies arranged in line along the strip on a common mounting, which may if desired be divided subsequently. In yet another arrangement (Fig. 7, not shown) the lead spacers are in the form of rings with the leads and electrode sections extending therefrom in a generally radial direction. In all eases the strip may be formed by stamping, etching or machining and the leads coined to facilitate insertion in conventional sockets. Instead of an integrated circuit a ceramic or laminated plastic plate carrying individual diode and transistor bodies and other circuit elements may be mounted in the package. |
