| 摘要 |
PURPOSE:To realize reduction in size by accommodating or setting a substrate and support base for grounding into a metallic case allowing soldering and by connecting the grounding circuit of substrate to said support base. CONSTITUTION:A circuit substrate 13 is bonded 14 to internal side of a case 11 of Ni-plated Al plate. The specified circuit elements are built into the substrate 13 and connected adequately to the supports 20a, 20b with the Al leads 21a, 21b. The support 22 coupled with the grounding circuit provided in the vicinity of grounding support 15 is connected to the support 15 with the lead wire 23. A terminal pin 25 is buried in the synthetic resin case 24 and is connected to the corresponding circuits with the lead wires 26. Thereafter, a filling material 27 is packed and the upper side is sealed with a cover 28. In this structure the ground pin is no longer necessary and a device as a whole can be reduced in size. Moreover, the grounding circuit is stabilized and respective parts can be assembled very easily. |
