A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A THERMOSETTING RESIN FILM

摘要

In the method a photoresist film 4 is formed. The photoresist film 4 is hardened by heat treatment. A thermosetting resin film 6 is formed over the hardened photoresist film. A further heat treatment, to cure the thermosetting resin film 6, is carried out at a temperature above 300 DEG C. …The photoresist film 4 may be formed over a conductor layer 2 and an insulator layer 3 on a substrate 1. To give access to the conductor layer 2 a window is opened in the hardened photoresist film 4 and insulator layer 3 is etched through the window to form an opening 5. …The thermosetting resin film 6 is formed over the hardened photoresist film 4 and in the opening 5 but is removed from opening 5 before the thermosetting resin film 6 is cured.