| 摘要 |
PURPOSE:To allow to obtain an excellent transversal mode characteristic and a far view image, by slightly projecting one end surface which emits the laser light of a chip fixed on the upper surface of a submount with a solder from the side surface of the submount. CONSTITUTION:The laser diode chip 4 is fixed on a mount 2 with the solder 5 in the state that the emitting part which emits the laser light 6 is in access to the submount 2. The end surface of this chip 4 having one side emitting surface is projected from one side surface of the submount 2 by (b). The value b is several mum-several tenmum. Thus, even when the solder 5 overflows, it is concealed under the lower surface of the chip 4 resulting in the porjection thereof to the side of emiting surface by fixing the chip 4. Thereby, since the laser light does not reflect on the solder bump and the upper surface of the mount 2, the transversal mode defective of a laser light does not generate. Further, since the laser light is not interfered by the bump, the turbulence of a far view image does not generate. |
