| 摘要 |
PURPOSE:To avoid influence of floating capacitance due to micro-particles in the shielding layer by laminating a polyimide resin layer and that which the alpha ray is not irradiated and the solid micro-particles which shield such ray are dispersed on semiconductor element. CONSTITUTION:The poly-Si Al, PbO in the particle diameter of 0.3-5mum are mixed within the range 1/4-1/8 of the weight ratio of particle/resin. When a thin polyimide resin layer is coated in the thickness of about 100mum and the polyimide resin layer containing micro-particles is then laminated, a soft error can be effectively prevented, generation of crack due to thermal stress is suppressed and moreover there is no substantial change of characteristic without increase of floating capacitance due to micro-particles in the shielding layer. |
