| 摘要 |
1070-70 Chip Capacitor for Compliance Soldering The present invention is directed to a monolithic capacitor adapted to be secured to a substrate by reflow soldering methods, characterized by the configuration of the capacitor causing the solder to form a compliant mechanical bond between the capacitor terminations and underlying substrate, whereby the likelihood of capacitor failure due to termal or mechanical shock is greatly reduced. The invention further relates to a mothed of making a capacitor of the type described. |
