| 摘要 |
<p>PURPOSE:To raise the yield of a multi-layer wiring circuit by altenately lengthening the terminals of the signal lines of an upper layer wiring line constituting a matrix multi-layer wiring circuit for selectively supplying information to heating elements. CONSTITUTION:The lengths of lines at the terminals of a wiring line are varied in an extent to which short-circuit does not occur between the wiring lines due to soldering by deforming the shape of the terminals of the wiring lines into different lengths (uneven height) for every line arranged at equal pitches. Thus, the thickness of a Cu solder layering formed by an electric plating method can be increased, the resistance value of the wiring line can be reduced, and the heat efficiency can be raised. Also, the yield of forming a multi-layer wiring circuit can be greatly improved.</p> |
