| 摘要 |
PURPOSE:To make the hardness of the lead frame larger than only a Cu material, and to prevent the generation of the bend of the lead by plating a metal (such as a Fe-Ni group alloy, Fe, Al, a Cu group alloy, etc.) except the precious metals with Cu without using only the Cu material as a blank. CONSTITUTION:The lead frame is formed by a substance such as the Fe-Ni group alloy. A chip base plate 2 and a bonding section 3 are spottily plated 4 with Cu as shown in oblique lines in the figure in both surfaces or one surface of the lead frame, and the plating 4 of the Cu may be formed before or after the lead frame is etched or molded by means of a press. |
