| 摘要 |
PURPOSE:To prevent the exposed part of a bonding pad from errosion and to provide a reliable one, by a method wherein polysilicon in which impurity is deffusioned is used instead of Al bonding pad. CONSTITUTION:The part except for a bonding pad part 6 is formed by the same method as before, but the bonding pad 6 is formed by polysilicon film 8 in which impurity is deffusioned, and is connected to the Al wire 4 at an end part 4a. By using such the polysilicon as a bonding pad that has to be exposed because of the bonding process, the wiring is prevented from errosion and disconnection, because polysilicon is unchanged even if it is put in a place of high temperature and high moisture. |
