| 摘要 |
PURPOSE:To facilitate designing of the IC having multikind functions as well as to contrive high density of the titled semiconductor pellet by a method wherein an auxiliary pellet, which is smaller than the main pellet, is mounted on the main pellet in such a manner that they are put together at the web parts, and they are electrically and mechanically connected through the intermediary of a solder bump arranged at the same position as the auxiliary pellets. CONSTITUTION:The main pellet 4 is attached to a stationary stand 4, the auxiliary pellet 20 is attached to a movable stand 5, and a positioning is performed by shifting the stand 5 with a motor 8 while detecting a positioning pattern 3 using a translucent mirror 6 and a light-emitting detector 7. A solder bump 9 is attached to the electrode 2 for connection on the main pellet, the stand 5 is lowered, the solder pump 9 is molten by heating and connected. The obtained composite pellet is fixed to the island 12 on the package 11, an external electrode for connection 1 on the main pellet is connected 14 to the electrode 13 of the package, and an elastic metal piece 16 is inserted, and sealed by a lid 15. According to this constitution, the IC having multikind functions can be formed in high density easily, and also it can be placed in the package which has heretofore been in use. |
