| 摘要 |
PURPOSE:To prevent oxidation of mount material and reduction of mount property, by a method wherein an injection hole is provided on a cover of a semiconductor mount device and opening of the cover is cleaned by non-oxidizing gas. CONSTITUTION:A cover 11 has an air injection hole 11a at upper lateral side of an opening 3, and non-oxidizing N2 in heated state is ejected through the injection hole onto the opening 3. In this constitution, portion of a lead frame 10 at the opening 3 is set to produce maximum temperature at the mounting process, stretching of shielding screen of N2 prevents the atmospheric air flowing thereby oxidation of the mount material 6 and temperature decrease of the mount portion of the lead frame 10 are also prevented and the mount property is significantly improved. |
