| 摘要 |
PURPOSE:To prevent the short-circuit of the junction wire as well as to facilitate the adhesion thereof for the titled device by a method wherein the area of the island part of a lead is reduced, and a semiconductor pellet is partially adhered. CONSTITUTION:A Y type island 2', with the adhesion surface smaller than that of the main surface of a semiconductor pellet 1', is provided on a lead frame. According to this constitution, as the periphery of the island 2' is not exposed at the lower part of a connection region, no short-circuit trouble arising from wire connection generates. Also, as the lead frame of same shape can be applied to the semiconductor pellets of all sizes, this semiconductor device is suitable for the production of multikinds in a small quantity. |
