发明名称 RESIN MOLDED COIL
摘要 PURPOSE:To prevent surely the generation of corona discharge even when resin is peeled off from a resin moded coil, and to contrive to attain mass production of the resin moded coil by a method wherein a tape having favorable adhesion to resin and having conductivity is wound around a coil condcutor as to surround the outside thereof. CONSTITUTION:A coil conductor 2 and an interlayer insulating sheet 3 are lappedly wound together to form a loop type, and one end of a tape 4 having favorable adhesion to molding resin and having conductivity is fixed to the coil conductor 2 at the outest circumferential part of a coil 1 with a conductive and adhesive tape 5 or a conductive adhesive. One end of the tape 4 having conductivity is connected to the coil conductor 2 mechanically and moreover electrically. The tape 4 is wound around at least for one turn as to surround the outside circumferential face of coil interposing an interlayer insulating sheet 3 between the coil conductor 2 for prevention of a short-circuit, and another end is fixed with the adhesive tape or the adhesive. The product obtained by winding the tape 4 around the outside circumferential part of coil by this way is molded with the prescribed resin 7 to complete the production.
申请公布号 JPS5864004(A) 申请公布日期 1983.04.16
申请号 JP19810163801 申请日期 1981.10.14
申请人 FUJI DENKI SOUGOU KENKYUSHO:KK;FUJI DENKI SEIZO KK 发明人 WATANUKI YUUJIROU;TOKIMITSU FUJIO;NATSUME FUMIO;MAEDA TAKAO;ENDOU KIYOKAZU
分类号 H01F5/06 主分类号 H01F5/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利