| 摘要 |
PURPOSE:To prevent the deposition of copper on a resist formed on the surface of an insulating substrate except the part on which conductor wiring is formed by dividing a plating stage into two stages and carrying out plating with a plating soln. having lowered activity in the 1st stage. CONSTITUTION:An electroless copper plating soln. contg. copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, alpha,alpha'-dipyridyl and polyoxyethylene ether is prepd. A resist is formed on the surface of an insulating substrate except the part on which conductor wiring is formed. Plating is then carried out with the plating soln. in two stages. In the 1st stage, the activity of the plating soln. is lowered by reducing the concn. of at least the reducing agent in the soln. so as to prevent the deposition of copper on catalyst particles sticking to the resist and the substrate is immersed in the plating soln. having the lowered activity for <=5hr. |
