| 摘要 |
PURPOSE:To provide a titled board which improves bending strength, and peeling resistance, by a method wherein a mat moisture content of a surface layer and a back surface layer before molding is maintained at a specified value, organic polyisocyanate is coated as a binder, and they are laminated and hot-pressed. CONSTITUTION:With respective to abolute dry chip, preferably 2-10% organic polyisocyanate (preferably crude disphenylmethanedisocyanate into which an anylin-formaldehyde condensate is phosgenized) is applied as a binder to a board surface and a board back layer in which a mat moisture content is kept to 20wt% or more. The surface layer and the back surface layer are laminated through the medium of a core layer which said binder is coated, where necessary, and a mat moisture content is maintained at preferably 10% or more, the lamination is molded by hot-press, thereby obtaining the desired board. |
