SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To manufacture the semiconductor integrated circuit device including output terminal with less resistance without sensing the resistance generated naturally by a method wherein the conductive line is provided between bonding pad of semiconductor integrated circuit element and external terminal making use of small metallic wire. CONSTITUTION:The overall semiconductor integrated circuit device including DC voltage stabilizing circuit is indicated by equivalent circuit in the diagram. As evident in the diagram, external terminal 3 leading output is connected to bonding pad 3' connecting to emitter of output transistor Q1 as well as to bonding pad 3'' connecting to input point of error amplifier A comprising detection transistor as usual to constitute the negative feedback circuit. Consequently the effect of resistance Rw in the conductive line becomes negligible while the output resistance may be reduced down to 10mOMEGA or less even if small metallic wire with diameter of 50mum or less is utilized.