| 摘要 |
PCT No. PCT/EP80/00101 Sec. 371 Date May 21, 1981 Sec. 102(e) Date May 7, 1981 PCT Filed Sep. 19, 1980 PCT Pub. No. WO81/00923 PCT Pub. Date Apr. 2, 1981.A planar, solid, light-transmitting coating (7) is applied directly to a photoresist layer (6) before the exposure of the latter in the production of integrated circuits by photolithography. Any dust particles will thus be held separated from the photoresist layer (6) by a distance at which they are less effective optically. The probability of the occurrence of standing waves is reduced by increasing the total thickness of the combined layer (6+7) covering the semiconductor (5) proper.
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