发明名称 MODIFIED EPOXY RESIN COMPOSITION
摘要 PURPOSE:To prepare the titled composition giving an extremely clear cured film having high flexibility, by reacting or mixing an epoxy resin with a specific modified adduct having imide or amide bond and half ester structure in the skeleton. CONSTITUTION:The objective composition is prepared by reacting and/or mixing (A) an epoxy resin with (B) one ore more modified adducts having an acid value of 5-100, preferably 10-50, containing imide bond and/or amide bond and half ester structure formed by the ring-opening of an acid anhydride group, and obtained by the reaction of (i) an adduct of a conjugated diene (co)polymer having a number average molecular weight of 300-20,000 and alpha,beta-unsaturated dicarboxylid acid (anhydride) and (ii) a compound of formula II (R2 is 1-18C hydrocarbon group which may contain cyano group, halogen atom, ether bond, or ester bond; n is 0-3).
申请公布号 JPS5861118(A) 申请公布日期 1983.04.12
申请号 JP19810159655 申请日期 1981.10.06
申请人 SUMITOMO KAGAKU KOGYO KK;TOUTO KASEI KK 发明人 HINO MINORU;OOSHIMA TAKAO;TACHIBANA AKIHIRO
分类号 C08G59/00;C08C19/36;C08F8/14;C08F8/30;C08F8/32;C08F8/46;C08G59/10;C08G59/14;C08G59/40;C08G59/50;C08L63/00 主分类号 C08G59/00
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