| 摘要 |
PURPOSE:To avoid disconnection, by superposing an inorganic insulating film having a window wherein the aperture is included inside on a high polymer resin film with the aperture on a substrate. CONSTITUTION:On the inorganic insulating film 13 of the high polymer resin film 12 on the substrate, a resist mask 14 with the aperture slightly larger than the fixed dimension is applied and etched resulting in window opening 15'. Next, the resist mask 14' having a window with the fixed dimension inside the window 15' is provided, and the high polymer resin film 12 is etched resulting in the aperture 15''. The mask 14' is removed, and a metallic electrode 16 is evaporated. In this constitution, overhang does not generate, and accordingly a wiring structural body without disconnections can be obtained. |
