| 摘要 |
PURPOSE:To enable sure detection of bonding of a cut piece of a soldering material by a vacuum suction needle, by detecting optically whether or not the vacuum suction needle sucks up the cut piece of the soldering material. CONSTITUTION:When a vacuum suction needle 6 sucks a cut piece 101 of a soldering material and moves to a die-pad member 30, an emitted light from a light-emitting element 10 to a light-receiving element 11 is intercepted by the cut piece 101, and thereby the light-receiving element 11 is not operated. When the needle returns to its home position after the cut piece 101 sucked so far thereby is bonded to the die-pad member 30, the emitted light from the light- emitting element 10 passes through the vacuum suction needle 6 and irradiates the light-receiving element 11, and thereby the light-receiving element 11 is operated. Accordingly, it is possible to detect surely, without any subsequent false poperation, that the vacuum suction needle 6 sucks up the cut piece 101 of the soldering material and makes it bonded to the die-pad member 30, by detecting the state of operation of the light-receiving element 11. |
