| 摘要 |
Production of semiconductor circuits such as flip flop arrangements, where stencil cannot be contacted with light-sensitive material in later production stages, is carried out by exposing and developing positive coating in areas where raised parts are to be fixed, then exposing to different pattern and using sensitive coating as plating protection agent during production of raised parts; latent image is then developed so that only those regions remain where metal electrodes are to be formed. |
