LEAD FRAME

摘要

PURPOSE:To recognize the positions of each lead easily and positively by changing the length of conductive layers formed to the wire bonding sections of the inner leads through plating or evaporation or coating or the like. CONSTITUTION:The conductive layers 12 are shaped to the nose sections of the inner leads 11 of the lead frame through plating or evaporation or the like in order to improve the bonding property of wires 16 bonded among the nose sections and the electrode pads 15 of a semiconductor pellet 14 attached onto a tub 13. The conductive layers 12 have the different length of three kinds, and are arranged so that mutual adjacent inner leads 11 positively have the conductive layers with different length. Accordingly, the positions of each lead can accurately be recognized by recognizing the length of the conductive layers 12 even when the position of recognition of the recognizing means of a wire bonding device is displaced left and right to some extent.