| 摘要 |
A carrier (T) which can be plugged onto a printed circuit board (LP) by means of a row of conductive pins (Pi) and consists of insulating material, for example of glass, glass fibre reinforced epoxy resin or ceramic, especially a carrier board for chips or a housing for chips of miniature construction, all the pins (Pi) being fitted along one side edge of the carrier and making a conductive connection via connecting pads to leads which are fitted on the carrier, the connecting pads being fitted together with the leads on the carrier (T), for example being printed on, the row of connecting pads being fitted along the side edge of the carrier (T), and at least some of the pins (Pi) in each case having a stop flap (AL) underneath the relevant side edge of the carrier (T), which stop flaps (AL) are bent at right angles to the pin axis for adjustment of the relevant pins (Pi) with respect to the carrier (T). <IMAGE>
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