| 摘要 |
PURPOSE:To prevent the breakage of a semiconductor wafer and the occurrence of improper solder thickness by a method wherein a wafer transit means playing between a supporting stand and a soldering tank while holding the semiconductor wafer is provided and the speed of the wafer carrying means is controlled. CONSTITUTION:A driving motor 14 is driven and a driving sprocket wheel 15 is rotated. In this way, a carrier 21 moves on guide rails 12a, 12b. A wafer 28 is vertically immersed in a soldering tank 13 through the level of the soldering tank 13. After retained the wafer 28 in the soldering tank 13 for a fixed time, the driving motor 14 rorates in the reverse direction to raise the wafer 28. Where, speed control is done at each position detecting point and the carrier 21 is returned to the stop position while varying the speed of the carrier 21 at arbitrary speed. |
