| 摘要 |
PURPOSE:To obtain a chip carrier which allows deposition of chips generating a large exotherm by boring an aperture when LSI chips are mounted to the circuit substrate, inserting thereto the one end of heat sink, soldering the chips to the inserting end of heat sink and by forming the determined wirings. CONSTITUTION:An aperture is opened to the circuit substrate 21 comprising internal wiring 27 in order to insert a heat sink 23 and a connecting pad 25 and external connecting terminal 26 are provided at the edge of substrate 21 surrounding an aperture. The substrate 21 is thus formed, the one end of heat sink 23 having good thermal conductivity is inserted into this aperture, an LSI chip 22 is secured thereto using the solder and thereafter this lead terminal 24 is connected to the pad 25. As explained above, the chip 22 is not mounted to the substrate 21 but directly to the end surface of heat sink 23. Thereby, a thermal resistance is reduced and high density integration of chip is realized. |
