发明名称 PLASMA TREATING APPARATUS
摘要 PURPOSE:To make it possible to carry out the plasma surface treatment of a material to be treated, in a plasma treating apparatus, by providing a metal net like electrode set to potential lower than that of an electrode so as to encircle material to be treated in close relationship to the periphery thereof. CONSTITUTION:When appropriate high frequency voltage is applied between electrodes 4, 5 from a high frequency power source 6, the ions of a gas from a gas source 11 have average voltage and a treating chamber 1 is also charged to certain voltage by the incidence of these ions. At this time, when the potential of a low potential electrode 7 is set to an appropriate value lower than both of the average potential of the gas ions and the charged potential of the treating chamber 1, the gas ions are led to the electrode 7 and impinged on the surface of a long material W through the mesh of the electrode 7 while accerelated. In this case, because the gas ions are uniformly distributed when passed through the mesh of the metal net like electrode 7, surface treatment is uniformly carried out.
申请公布号 JPS5858147(A) 申请公布日期 1983.04.06
申请号 JP19810156412 申请日期 1981.09.30
申请人 SHIMAZU SEISAKUSHO KK 发明人 KOYAMA TOMITAROU
分类号 B01J19/08;B29C59/14;C08J7/00;C23C16/505 主分类号 B01J19/08
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