| 摘要 |
PURPOSE:To obtain an acidic removing soln. for tin or a tin alloy capable of efficiently peeling solder or the like from its substrate of copper or the like by adding a heterocyclic compound contg. a nitrogen atom to iron ion and a hydroxycarboxylic acid as principal components. CONSTITUTION:An acidic removing soln. for tin or a tin alloy is prepared by adding a heterocyclic compound contg. a nitrogen atom as a constituent member of the ring in the form of =NH or N and not contg. a sulfur atom, e.g., imidazole to an acidic removing soln. for tin or a tin alloy contg. iron ion such as ferric chloride and a hydroxycarboxylic acid such as glycolic acid as the principal components. By immersing a copper or copper alloy member having stuck solder contg. tin, etc. in the prepared removing soln., the solder is thoroughly removed in a short time and no abnormality remains on the surface of the copper substrate. |
