| 摘要 |
This invention relates to the apparatus for the encapsulation of the semiconductor chip. The apparatus consists of the upper molding substrate(51), the lower molding substrate(41), the upper molding plate(52) and the lower molding plate(42). The upper molding plate is fixed at the upper molding substrate. Also, the lower molding plate is fixed at the lower molding substrate. The cavity plates (28, 29) have the even exterior (33, 34) and are located between the molding plate (52, 42).
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