发明名称 MANUFACTURE OF SEMICONDUCTOR PACKAGE
摘要 PURPOSE:To homogenize a gold film thickness, by providing a gold paste layer having an adhesion corresponded to a recess on a base body sheet having a mold releasing property, and transferring it into the recess, when forming a gold film in the recess provided on a substrate constituting a ceramic package. CONSTITUTION:On a film having the mold releasing property such as a polyethylene terephthalate or a melamine resin film 1 which is applied to a mold releasing treatment, the gold paste layer 2 which is constituted of gold powder at 20-90wt%, glass and inorganic substances at 0.2-20wt% and the remnant of paste organic substances and has the adhesion is formed to the fixed demension by a printing means. On the other hand, the recess 4 wherein the layer 2 subsides is provided on the ceramic substarate 3, the film 1 is mounted on the substrate 3 with the layer 2 sunk thereinto, and the layer 2 is transferred into the recess 4 by heating to 160-180 deg.C and pressing a presser 8. Thereafter, the film 1 is peeled off, and a gold film 5 is obtained by firing at 800-900 deg.C. Thus, the productivity of the formation of a gold film is enhanced.
申请公布号 JPS5857730(A) 申请公布日期 1983.04.06
申请号 JP19810156494 申请日期 1981.09.30
申请人 NIHON SHIYASHIN INSATSU KK;NORITAKE KANPANII RIMITEDO:KK 发明人 MATSUMURA KOUZOU;TAKAOCHI MINORU;OGAWA YUKIO;UEDA EIZOU;MATSUNAGA JINICHI;NAKAYAMA KAZUTAKA
分类号 H01L21/52;H01L21/58;H01L21/68;(IPC1-7):01L21/58 主分类号 H01L21/52
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