| 摘要 |
PURPOSE:To stop plating of silver for improving the bondability only to the necessary part by providing a metal container having a reflecting surface at one end of a conductive lead in the manufacture of an LED lamp, and arranging a photosemiconductor element in the container, thereby alleviating the restriction in the material of the reflecting surface and the pressing velocity, and reducing the deformation during handling. CONSTITUTION:Since a container 12 is constructed separately from a cathode lead 11 in an LED lamp, no restriction exists in the material of the lead 11 on the reflecting surface, but an aluminum foil having high reflectivity can be used. A recess is not necessary for the lead frame, but only a drawing step is required, and the pressing speed is accelerated by twice to three times of the conventional speed, and the deformation during the handling is extremely small. Further, since the difference between the ends of the lead 11 and the anode lead 16 is increased in the amount corresponding to the container 12 as compared with the conventional one, silver plating can be performed only on the bonding surface 16a to be originally necessary, thereby reducing the silver plating amount of approx. 1/3. |
