发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain an excellent light transmitting characteristics, bonding strength and airtight characteristic by forming a projection or a groove at the bonding part of a cap having a light emitting window and a light emitting window member and hermetically sealing it through a bonding member. CONSTITUTION:A kovar or iron-nickel alloy is used as a material of a cap 1 having a light transmitting window 2, is formed by pressing in a cap shape, and V-shaped groove of approx. 70 deg. of the end angle of the groove with the depth of approx. 0.1mm. is annularly arranged at the end of a molding punch, thereby simultaneously forming a projection according to this invention. The cap 1 is heated in acidic atmosphere at approx. 700 deg.C, an oxidative film is formed on the surface, and a low melting point glass to be coated on the cap is strongly hermetically bonded. The glass is coated on the hermetically sealing part 3 of the cap 1 with the window member 14, and is heated to approx. 500 deg.C, thereby performing the hermetical seal. A photosemiconductor element 7 is placed on the cap 1, and a base bonded with the lead terminal 8 is welded and secured, thereby hermetically sealing the element 7.
申请公布号 JPS5856482(A) 申请公布日期 1983.04.04
申请号 JP19810155103 申请日期 1981.09.30
申请人 SHINKOU DENKI KOGYO KK 发明人 SUDOU YASUAKI
分类号 H01L23/02;H01L31/0203;H01L33/48 主分类号 H01L23/02
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