| 摘要 |
PURPOSE:To enable an automation of manufacturing a semiconductor device by forming a frame made of a thin film of a material which does not affine with a solder around a position to be bonded with a semiconductor element, thereby enabling to bond the element to the correct position to simplify the step of bonding the element and the later steps. CONSTITUTION:A frame 8 of a thin film which does not affine a solder is formed by depositing the frame in a thickness of several mum around a position to be bonded with a semiconductor 1 of a substrate 2. As a result, the surface which affines with the solder and the part of the frame 8 which does not affine with the solder are formed on the surface of the substrate 2. Since the material of the frame 8 does not affine with the solder even when the solder 8 disposed between the element 1 and the substrate 2 is molten by heating, the solder does not externally flow out over the frame 8, but is retained in the frame 8. Accordingly, the element 1 is accurately positioned at the position to be bonded by the surface tension of the solder 3. Thereafter, the element is cooled while being accurately positioned as described above and is fixed. |
