| 摘要 |
PURPOSE:To facilitate stabilization of the seal quality of an IC or the like and mechanization of the sealing operation, by a method wherein a resin extruded by means of a pressurized gas is forced to uniformly run around in all directions by reciprocating a container itself while bringing the same into close contact with the IC or the like. CONSTITUTION:A substrate 10 and an IC or the like 11 bonded to the substrate 10 are disposed under a mask plate 13 having a mask opening 12 a size larger than the IC or the like 11. A substrate holder 14 is lifted from the lower side of the substrate 10 to bring the mask plate 13 and the IC or the like 11 into close contact with each other. After the IC or the like 11 and the mask opening 12 are aligned with each other, while a pressurized gas 20 is introduced into an air chamber 19 in a container 18 having a bottom 16 with an opening 15 and filled with a resin 17, the container 18 is reciprocated in the direction perpendicular to the longitudinal direction of the IC or the like 11, thereby to complete sealing of the IC or the like 11 with the resin 17. As the substrate holder 14 is lowered, the substrate 10 is transferred. |
