| 摘要 |
PURPOSE:To increase the specific resistance of solder considerably by adding a specific content of Bi to a conventional Sn-Ag alloy as solder for superconductors. CONSTITUTION:In the case of twisting or weaving plural pieces of superconductive wires, the superconductive wires are bound by means of solder in order to improve the stability among the superconductive wires and the mechanical strength over the entire part. As the solder to be used in this case, Bi is added at >=0.1% to a conventional Sn-5% Ag alloy and the alloy is used as an Sn- Ag-Bi alloy. Since such solder has considerably large specific electric resistance as compared to conventional solder and decreases the binding current induced among the superconductive wires, binding losses are decreased and the efficiency of the pulse magnets produced by said wires is improved. |
