| 摘要 |
Moulded wafer products are prepared by a novel process in novel apparatus from dough of high sugar content (25-60% w/w based on the farinaceous dough ingredient) by a two-stage process comprising initial baking of a light-textured water material (e.g. 2-3 mm thick), introducing the wafer while still hot (e.g. above 160-195 DEG C), into a cooling and compressing mould (3,4,5) of the apparatus, and compressing the wafer to reduce its wall thickness, e.g. by about 15-50%. |
