发明名称 LEAD WIRING LEADING DEVICE
摘要 PURPOSE:To improve the insulating withstand voltage of a lead wiring leading device by forming a terminal rod of a fiber reinforced plastic produced by compressing a plurality of sheets prepared by fixing glass cloth with epoxy resin. CONSTITUTION:The terminal rod 13 of a lead wiring leading device 11 is inserted into the hole 15 of a substrate 12 and is formed in FRP cylinder. The FRP is formed by fixing glass cloth with epoxy resin to form sheets and compressing many stacked sheets, and when the substrate 12 and the cylindrical rod 13 are thereafter formed, the glass cloth of the FRP is formed clearly in mesh shape. In this manner, the insulating withstand voltage can be further improved.
申请公布号 JPS5854688(A) 申请公布日期 1983.03.31
申请号 JP19810153054 申请日期 1981.09.29
申请人 TOKYO SHIBAURA DENKI KK 发明人 NAKAYAMA SHIGEO
分类号 H01F6/00;H01B17/26 主分类号 H01F6/00
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