| 摘要 |
PURPOSE:To provide a protection film on the chip surface by placing a resin film in the thickness of 75mum with apertures on the semiconductor chip surface and dropping the resin liquid to said apertures. CONSTITUTION:The polyimide film 3a with apertures 6 in the thickness of 125mum is placed on the Si chip 1 covering the cell region and the polyimide solution 5 is dropped into said apertures 6 for the purpose of coating. The polyimide 5a also penetrates into the lower part of film 3a and plays a roll of bonding agent for the chip 1. In this method, water generated when the polyimide is hardened, remaining solvent and air are exhausted 7 from the apertures 6, the periphery of ship is coated with the polyimide in the thickness of 125mum and thereby a soft error by the alpha ray can be improved. |
