发明名称 |
HIGH PERFORMANCE SEMICONDUCTOR PACKAGE ASSEMBLY |
摘要 |
<p>High Performance Semiconductor Package Assembly An improved high performance semiconductor package assembly for interconnecting a plurality of integrated circuit devices having a multilayer substrate with internal wiring including signal wiring and external signal and power connections, a plurality of integrated circuit semiconductor devices supported on the top surface of the substrate in electrically connected operative relation, the improvement being a power supply distribution system for providing electrical supply voltages to the devices from the power connections consisting of radial waveguide structure including parallel waveguide planes with a low input impedence to reduce switching noise, the waveguide planes located between the signal fan-out wiring and internal wiring metallurgy and connected in common to all of the plurality of devices.</p> |
申请公布号 |
CA1143862(A) |
申请公布日期 |
1983.03.29 |
申请号 |
CA19800365431 |
申请日期 |
1980.11.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARBOUR, DONALD R.;LEMKE, GUIDO A.;MAGDO, STEVEN |
分类号 |
H05K3/46;H01L23/14;H01L23/538;H01L23/66;(IPC1-7):H05K1/14 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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