| 摘要 |
PURPOSE:To perform correct bonding of fine metal wires recognizing correctly bonding pads of a semiconductor chip by a method wherein a filter is provided in space between a television camera and the semiconductor chip. CONSTITUTION:The filter 30 is provided in space between the semiconductor chip 10 and the television camera 20. Because wave length of a light source in the television camera is fixed, light to return to the camera reflecting on the surface of metal has various angles owing to interference of light or refraction in a protective film to be generated by unevenness of film thickness of the protective film. The filter 30 transmits light reflected from the bonding pads, while light passed through the protective film is not transmitted. Therefore the television camera 20 recognizes only the bonding pads 7, 8 correctly. Thus bonding at the correct position is performed. Because the bonding pads on the semiconductor chip can be recognized correctly, and bonding at the correct position can be performed, and because the bonding device to enhance the good articles obtaining ratio in the manufacturing process can be obtained, the effect thereof is made remarkable. |
