| 摘要 |
PURPOSE:To prevent generation of disconnection or deformation of bonded fine metal wires at a resin sealed semiconductor by a method wherein thermoplastic resin of polyphenylene sulfide, etc., is used, and the temperature and the current speed of melted resin are controlled using a hot runner by an injection molding machine. CONSTITUTION:Melted polyphenylene sulfide is filled up in a reservoir 3 for melted resin provided with the hot runner main body 1, and is regulated to the melting temperature of 290-310 deg. by the injection molding machine. When newly melted resin is injected from the injection molding machine, melted resin in the reservoir 3 for melted resin is filled up in a cavity 4 through a hot runner chip 2 to seal a lead frame 7, an IC chip 5 and the metal wires 6. When new resin is to be injected, the hot runner chip 2 is heated to melt solidified resin. The temperature of metal molds 8, 9 on the fixed side and on the movable side is set in the range of 150-220 deg.C. The most suitable current speed in the cavity 4 to generate no deformation of the metal wires 6 or to generate no short shot is in the range of 0.3-3cm/sec. |
