发明名称 INSPECTING METHOD OF PRINTED SUBSTRATE
摘要 PURPOSE:To position a probe in a proper position even if a printed substrate is subjected to thermal expansion and contraction, by installing a camera to an XY table provided with the probe, and inputting a picture image of an IC lead directly by this camera. CONSTITUTION:On an XY table 1 moving in parallel with a printed substrate surface, a camera 7 is provided together with a probe 2. The camera 7 is constituted so as to input a picture image on the printed substrate, and to reflect a pattern pad 8 and a lead 5 of an IC. A scanning line 10 is derived from an inputted picture image 9 and subsequently a level of the scanning line 10 is confirmed by a threshold level 11, by which size is decided. By deciding this size, a binary-coded signal 12 is generated, and expansion and contraction legnth DELTAl of a lead 5'' and a pattern pad 8'' is calculated. Subsequently, by correcting a positioning data, the probe can be positioned properly even if the printed substrate is subjected to expansion and contraction.
申请公布号 JPS5852576(A) 申请公布日期 1983.03.28
申请号 JP19810149486 申请日期 1981.09.24
申请人 HITACHI SEISAKUSHO KK 发明人 KAWARADA MASAYUKI;URUSHIBARA TAKESHI;SAKUYAMA TOMOJI
分类号 G01R31/28 主分类号 G01R31/28
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