| 摘要 |
PURPOSE:To arrange the semiconductor pellet divided through dicing to the second adhesive tape with high accuracy by mounting a supporter for bending the first adhesive tape so that an adhesive surface is directed to the outside. CONSTITUTION:A mechanism moving a plurality of the semiconductor pellets 12 pasted onto the adhesive surface of the first adhesive tape 11 to the second adhesive tape 16 held so that the adhesive surface of the second adhesive tape is opposed to the first adhesive surface is mounted. The supporter 19 for bening the first adhesive tape 11 so as to be directed to the outside is set up at that time. The tape 11 is forwarded in the arrow (A) direction, and the first row section 121 of the pellets is carried onto the edge 191 of the supporter 19, and fixed. The tape 16 is pressed down by means of a plate, contacted onto the first row section 121 of the pellets, and torn off. The first row section 121 of the pellets pasted onto the tape 11 is moved to the tape 16. |
