| 摘要 |
PURPOSE:To facilitate the attachment and detachment of a flip chip IC to and from a hybrid IC by providing an opening end for infrared ray introduction and an opening for heater inert gas introduction. CONSTITUTION:A flip chip IC5 can be installed on a specified position of a hybrid IC by placing a bonding jig 60 to surround the flip chip IC5, introducing a preheated inert gas 9 through an opening 60b and radiating infrared rays 8 into an opening end 60a to dissolve a solder bump 7 and solder of a conductor 3. The same method can apply to the removal of the flip chip IC. Because the solder fuses only during the radiation of the infrared rays 8, the diffusion of the conductor 3 into the solder is negligible, causing no degradation in the bonding strength. |
