| 摘要 |
PURPOSE:To enable even wafer drying processing with a compact apparatus structure and to reduce the cost of exhaust and the danger of ignition by treating wafers piece by piece. CONSTITUTION:While being transferred through a water tank 1 with a pusher 3, a wafer 2 is washed and sent to a transfer intermediate guide 4 where it is received by a stopper 6, and the guide 4 turns 90 deg. about its rotation axis in the direction shown by the arrow to hold the wafer in a vertical position. With the stopper 6 opened, the wafer is received by a pusher 10 by the descending movement of which the wafer is sent to a wafer holder 11 for it to be held in a daughnut-shaped drying room 9 in a drying tank 5. Since a treatment solution 12 is vaporized by being heater with a heating portion 13, the interior of the drying room 9 is in a drying atmosphere. Therefore, the wafer 2 is dried while being rotated counterclockwise and then moved to the position under a transfer intermediate guide 16 from which it is carried out in the reverse order of the operation of the guide 4. |
