发明名称 DIFFUSION BONDING METHOD
摘要 PURPOSE:To bond base metals easily at high accuracy by disposing two kinds of thin piece of brazing metals for diffusion bonding different in melting point between base metals and liquid phase diffusing the low melting point brazing filler metal at first and then diffusing high melting point brazing filler metal utilizing isothermal coagulating phenomenon. CONSTITUTION:At least one sheet of brazing filler metal 2 of a low melting point and brazing filler metal 2' of a high melting point are placed in parallel between base meals 1, 1' to be bonded, and heated at a temperatue higher than the melting point of the brazing filler metal 2 of a low melting point and lower than the melting point of the brazing filler metal 2' of a high melting point while applying pressure between base metals 1, 1'. The temperature is maintained for a specified time to cause melting of the brazing filler metal of a low melting point and to cause liquid phase diffusion. Then, temperature is raised to a temperature higher than the melting point of the brazing filler metal 2' of a high melting point and lower than liquid phase temperature formed by isothermal coagulation phenomenon of the brazing filler metal 2 of a low melting point. The temperature is maintained for a specified time to cause melting of the brazing filler metal of a high melting point and liquid phase diffusion. Thus, bonding can be made at high accuracy without causing deviation of relative position of base metals 1, 1'.
申请公布号 JPS5850187(A) 申请公布日期 1983.03.24
申请号 JP19810148720 申请日期 1981.09.22
申请人 TOKYO SHIBAURA DENKI KK 发明人 TAKEDA HIROMITSU;KOMATSU SHIYUUICHI;NAKABASHI MASAKO;SHIMANUKI SENJI
分类号 B23K20/00;B23K1/00 主分类号 B23K20/00
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